Die yield
Beginner
The share of chips on a wafer that come out working.
Novice
The fraction of chips on a wafer with no fatal defect. It falls as chip area grows, because a bigger chip is more likely to catch one. The simplest model is , where is defects per cm² and is the chip’s area.
Expert
Modeled with Poisson, Murphy, Seeds or negative binomial statistics, which differ in how they treat defects that bunch together. Bunching leaves more chips clean than random scattering would, so the Poisson model is pessimistic for large chips; the negative binomial’s cluster parameter sets how strongly defects bunch.
Explained in Specification (Design Flow).
See also: Defect density (D₀), Dies per wafer.