Glossary

Dies per wafer

Beginner

How many copies of a chip fit on one wafer, the thin round slice of silicon that chips are made on.

Novice

Roughly the area of the round wafer divided by the area of one chip, minus the partial chips lost around the curved edge. Smaller chips fit more copies and waste less at the edge.

Expert

A common estimate is π(d/2)2/A−πd/2A\pi (d/2)^2/A - \pi d/\sqrt{2A} for wafer diameter dd and die area AA. Real counts also subtract the scribe lanes (the gaps where the wafer is sawn), an unusable rim at the edge, and test structures.

Explained in Specification (Design Flow).

See also: Die yield, Cost per good die.

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