Extras · Industries · Personal and edge devices

Personal and edge devices

Phones, wearables, and sensors, where battery life is the spec, every square millimeter is a cost, and most of the chip is asleep most of the time.

Near-threshold operation (400–500 mV)
Up to 10× less energy, ~10× slower
Doubling die area, 60 → 120 mm² (textbook example)
About 2.4× cost per good die
Michigan Micro Mote: active power vs harvester
Tens of µW vs tens of nW

At a glance

Where the flow bends

  1. 01Specification

    The most important goal is how long the battery lasts. So the plan says how much energy each everyday task may use.

    The specification, the document that says what the chip must do, sets an energy budget for each everyday task (standby, playing music, listening for a wake word) next to targets for chip size and cost per unit.

    Power is specified per mode and per use case, including leakage budgets at the hot corner (the top of the temperature range, where leakage is worst) and limits on wake-up latency. Security certification goals and the list of radio and analog IP blocks are fixed here too.

  2. 02Architecture

    The chip is split into zones that can be switched off one by one. One small zone stays awake to listen for a tap or a message.

    Architects divide the chip into power domains, regions whose supply can be switched off separately, plus a small always-on island. They choose the voltage and speed settings the chip can run at, and which jobs go to dedicated engines (an AI accelerator, a signal processor) instead of the main processor.

    The power-state table (which domains may be on together, the order of transitions, and what each domain keeps while off) is an architectural deliverable. Most blocks are licensed or reused, so much of the architecture work is integration and power-state design.

  3. 04Verification

    Engineers test every mix of zones being on and off. A zone that wakes up wrong can freeze the device or drain the battery.

    Ordinary simulation assumes every part of the chip is always powered. Here a separate power-plan file tells the simulator which parts are off, so tests check that powered parts are protected from unpowered ones, that saved values come back, and that power-up happens in the right order.

    Power-aware simulation reads the UPF and corrupts the outputs of any domain that is off. Coverage must include every power-state transition, retention save and restore, and reset ordering; static checks confirm isolation and level-shifter placement against the UPF before and after synthesis.

  4. 05Logic synthesis

    Where there is time to spare, the tools pick slower parts that waste less power. They also add the special parts the power plan needs.

    Synthesis, the step that turns the design’s code into a list of logic gates, picks slower but less leaky gates wherever there is time to spare, adds circuits that stop the clock to idle logic, and inserts the special cells the power plan calls for.

    Synthesis maps to libraries of several threshold voltages, inserts clock gating, and adds isolation cells, level shifters and retention flops from the UPF. After timing closes, leakage recovery swaps non-critical cells to high-Vt. UPF-driven insertion must be equivalence-checked, and area is optimized hard because at phone volumes area is unit cost.

  5. 07Floorplanning

    Each zone that can switch off gets its own patch of the chip. The radio is kept away from busy, noisy parts.

    The floorplan, the first rough layout of the chip, gives each switchable region its own area, leaves room for the power switches, and keeps sensitive radio and analog circuits away from noisy digital logic.

    Voltage areas, always-on routing channels, switch placement, and guard rings or substrate taps around analog and RF macros are fixed here, and die area is minimized aggressively.

  6. 08Power planning

    Switches cut power to sleeping zones. They turn back on a few at a time, so the sudden rush of power doesn’t upset the rest of the chip.

    Power reaches each switchable region through rows of transistor switches, with separate, always-powered wiring for the logic that must stay awake. The switches turn on a few at a time, so the rush of current into a waking region doesn’t disturb the rest of the chip.

    Header or footer switch count and daisy-chaining set wake-up time and in-rush current. Always-on rails must reach the retention and isolation cells inside switched domains.

  7. 12Signoff

    The final checks run at many power levels and temperatures. On very low power, chips get slower and harder to predict.

    The final timing and power checks are repeated for every voltage and speed setting and every power mode, with leakage checked at high temperature, where it is worst.

    Multi-mode multi-corner analysis multiplies with DVFS points and domain-voltage combinations. Low-voltage corners need variation-aware timing, and leakage is signed off at the hot corner.

Phones, watches, earbuds and tiny sensors all run on batteries. For them, battery life is the most important number. Chip designers start from it and work backward.

The trick is that the chip is asleep most of the time. Think of a house at night. You turn off the lights in empty rooms, but the fridge stays on. A phone chip does the same. It uses to cut power to parts it isn’t using. A small part stays awake to listen for a tap or a message.

These chips sell by the millions, so each one must be cheap. A smaller chip costs less to make. Save a few cents on each one, and across a hundred million phones it adds up to millions of dollars.

The chip in a phone or watch is a : processors, graphics, an AI engine, radios and much more on one piece of silicon. Its designers start from the battery. Every task, from playing a song to waiting for a notification, gets an energy budget, and the design is shaped to meet it.

A chip uses power in two ways:

  • Switching. Each time a transistor flips, it charges or drains a tiny amount of electrical charge. This grows with how often things switch, with the clock speed (the rate of the chip’s internal heartbeat), and with the square of the supply voltage: run at 0.8 V instead of 1.0 V and each switch costs about 36% less energy.
  • Leaking. Transistors are imperfect switches and let a little current through even when off. This flows whenever a part is powered, busy or not, and can be 20–40% of a processor’s power budget in recent manufacturing processes.

Edge chips attack both with four standard techniques:

  • stops the clock to logic that has nothing to do, so it stops switching.
  • cuts the supply to idle blocks with a transistor switch, so they stop leaking too.
  • lowers voltage and clock speed when the workload allows.
  • uses fast, leaky transistors only where speed is needed and slower, low-leakage ones everywhere else.

Designers write down which blocks can turn off, and how, in a file. UPF is the IEEE 1801 standard for this “power intent,” and the same file is used both to check the design and to build it.

An edge is best understood as a state machine of power modes. Each mode (deep sleep, always-on listening, music playback, full performance) has its own set of powered , voltages and clocks. Every transition between modes needs four things, in order: on the outputs of a domain about to go dark, so its floating signals can’t reach live logic; on signals between domains at different voltages; or a software reload of any state that must survive; and a power-up sequence that releases these in reverse. The savings are large, but each new domain multiplies the states and transitions that have to be verified.

The Michigan Micro Mote team describes exactly this cost. Their chips use several power domains to minimize leakage. Isolation and level conversion between them were largely manual, because tool support lagged their aggressive power gating, and as a result they often did not simulate every power state before fabrication.

CPUidleleakGPUidleleakNPUidleleakRadiobusyAudio DSPbusyAlways-onbusypower (illustr.)full56%leakageswitching
Power mode
Techniques

Music playback: the audio DSP and the radio work. Power: 56% of full (leakage 46% of it). 3 idle blocks still burn clock power and leak. Turn on the techniques.

Clock gating stops idle logic switching; power gating also stops it leaking. Pick a mode, then turn the techniques on. Power units are illustrative.Share freely with credit: ‘Figure from chipfieldguide.com’
  • Battery life. People judge a phone or watch by how long it lasts. So saving energy comes first.
  • Cost. A smaller chip is cheaper, and that adds up over millions of devices.
  • Everything on one chip. Processors, radios, camera parts and AI share one chip, to save space and power.
  • Security. Your fingerprint and payment keys live on the chip, in a locked-off part called a .

Area is cost. Chips are made many at a time on a round silicon wafer, and a few random defects land on every wafer. A bigger chip means fewer chips per wafer and a higher chance that each one catches a defect. In a standard textbook example, doubling chip area from 60 mm² to 120 mm² raises the cost of each working chip about 2.43×. At phone volumes, a few square millimeters is real money.

Integration. The same chip often carries the radios for cellular, Bluetooth and Wi-Fi. RF CMOS, the technique of building radio, analog and digital circuits in one ordinary chip process, is what makes that possible, and it is used in the radio transceivers of modern phones. Most blocks on such a chip are licensed from other companies or reused from earlier designs, so connecting them and planning their power states is much of the job.

On-device AI. Phone chips now include an , a block built to run AI models. A 2019 survey of chips from Qualcomm, HiSilicon, Samsung, MediaTek and Unisoc found mobile AI accelerator performance nearly doubling with each chip generation.

Security. Apple’s Secure Enclave is an independent subsystem on its phone chips that protects data even if the main processor is compromised. It has its own processor, a hardware random number generator, a public-key accelerator, and a memory protection engine that encrypts its memory with AES.

Mixed-signal coexistence. Every digital transition injects a little current into the shared silicon substrate, and that noise travels to sensitive analog and radio circuits on the same die. The standard mitigations are physical separation between noisy and sensitive blocks, careful placement of substrate contacts, guard rings and wells that collect the stray current, controlled signal transition times, and careful routing of the power lines. All of these land in the floorplan and power plan, not in the RTL, so they are decided by the physical design team rather than the logic designers.

Side channels. A chip’s power draw depends on the data it is processing, so a trace of its power over time can reveal a secret key. Differential power analysis, which averages many such traces and correlates them with guesses about the key, is practical, non-invasive and works even when the cryptography is a small fraction of the chip’s total power. Running the Secure Enclave on its own physically separate processor gives it built-in resistance to some software-driven from the main processor, such as cache-timing attacks. Physical leakage still needs countermeasures in the crypto hardware itself, and Apple adds undisclosed ones.

The leakage floor. In deep sleep almost everything is off, so standby battery life is set by the leakage of the always-on domain and of any retention supplies. Leakage rises steeply with temperature, so the cell library for that region is often chosen by its leakage at the hot corner rather than by its speed.

CPU clusterGPUEnclaveNPUMemory, I/OAlways-onRFcleanArea = cost60 mm²120 mm²×1×2.43cost / good die
Try

One system-on-chip, many jobs. Tap a block, or run the processors to see the noise problem.

A generic phone SoC (not to scale). Tap a block; run the CPU to see substrate noise reach the radio, then add a guard ring. Cost example from a textbook.Share freely with credit: ‘Figure from chipfieldguide.com’
  1. Write a power plan. Next to the design, engineers write a plan for which parts can switch off, and how.
  2. Test every on/off mix. A part that wakes up wrong can freeze the device or quietly drain the battery.
  3. Keep the radio apart. The radio is placed away from busy, noisy parts of the chip.
  4. Check the hard cases. Chips run slower on low power and waste more when hot, so both are tested.

A chip’s behavior is written as code in a hardware description language, called . The power plan is kept out of that code, in a separate file, and the same file guides every later step. In plain words, the plan for a phone chip with a switchable AI engine might say:

RegionCan turn off?What the plan adds
Always-on islandNeverWake-up logic, timers and the power controller live here.
AI engine (NPU)Yes, when idleA power switch; isolation cells that hold its outputs at 0 while it is off; retention flip-flops that save its settings.
Main processorsYes, and they can slow downSeveral voltage and speed settings; , cells that translate a signal from one voltage to another, where their wires meet lower-voltage regions.

Each later step reads that plan:

  • Verification (checking the design before it is built) simulates parts switching off. The simulator fills an unpowered region’s outputs with garbage values, so a test fails if any wire is left unprotected.
  • Synthesis (turning code into logic gates) inserts the , level shifters and the plan asks for, adds clock gating, and picks low-leakage gates wherever there is time to spare.
  • Layout gives each switchable region its own area with rows of power switches, and keeps radios and analog circuits away from noisy logic.
  • Final checks repeat the timing and power analysis at every voltage setting, at low voltage where the chip is slowest, and at high temperature where it leaks most.

The power intent lives in , separate from the RTL, and the same file drives both verification and implementation. A trimmed, illustrative example for a switchable NPU domain:

soc_power.upf (illustrative)tcl
# Power intent for a switchable NPU domain (IEEE 1801 style, trimmed)
create_power_domain PD_AON -include_scope
create_power_domain PD_NPU -elements {u_npu}

create_supply_net VDD_AON
create_supply_net VDD_NPU_SW

create_power_switch SW_NPU -domain PD_NPU \
  -input_supply_port  {vin  VDD_AON} \
  -output_supply_port {vout VDD_NPU_SW} \
  -control_port       {sleep npu_sleep} \
  -on_state           {on vin {!sleep}}

set_isolation ISO_NPU -domain PD_NPU -applies_to outputs \
  -clamp_value 0 -isolation_signal npu_iso -isolation_sense high

set_retention RET_NPU -domain PD_NPU \
  -save_signal {npu_save high} -restore_signal {npu_restore low}
  1. 1L2Everything not assigned elsewhere belongs to the always-on domain.
  2. 2L3The NPU instance gets its own domain so it can be powered off independently.
  3. 3L6The switched (“virtual”) rail that only exists while the switch is closed.
  4. 4L8A power switch feeds the NPU’s virtual rail from the always-on supply; npu_sleep opens it.
  5. 5L14Isolation clamps NPU outputs to 0 while it is off, so floating values never reach live logic.
  6. 6L17Retention flops save state on npu_save before power-down and restore it on wake-up.

Read it as a sequence. To power down, the controller asserts npu_save (state copied into retention latches), then npu_iso (outputs clamped), then npu_sleep (switch opens). Power-up closes the switch, waits for the rail to settle, restores the retained state (npu_restore), and only then releases npu_iso. Getting that order wrong is one of the classic bugs the flow has to catch.

Verification. Power-aware simulation reads the UPF and drives unknown values onto the outputs of any domain that is off, so a missing isolation cell shows up as a corrupted value downstream. Coverage targets include every legal power state, every transition, retention save and restore, and reset ordering. Cold boot is a special case: the Micro Mote team needed a dedicated power-on reset for its isolation network, because at cold boot even the nominally always-on signals are still rising. Static UPF checks, which confirm every crossing has the cell it needs without simulating anything, are rerun on the RTL, on the gate-level netlist and after place-and-route, because each step can add or move crossings.

Implementation. Each switched domain gets a voltage area (a fenced region of the floorplan), switch cells, and always-on routing for retention supplies and isolation enables. The M3 chips gave each power domain its own clock network, so the clock tree would never unexpectedly cross a domain boundary. Analog and RF macros get guard rings and substrate taps.

Signoff. Timing is checked at every combination of operating point and corner, and the combinations multiply: DVFS points×domain voltage combinations×process×temperature\text{DVFS points} \times \text{domain voltage combinations} \times \text{process} \times \text{temperature}. Five operating points, two domain configurations and six process–temperature corners already make 60 timing runs. Near-threshold operating points widen the spread of gate delays, so they need variation-aware timing margins. Leakage is signed off hot, and dynamic power is checked against activity profiles recorded from real use cases.

Power plan (UPF)Always-onnever offNPUswitch, iso, retainCPUDVFS, level shiftersseparate from the RTLPower planNPUCPUAlways-onRF
1 / 5

The UPF file names each region, which can switch off, and the protection cells. It is kept separate from the RTL.

The UPF power plan from the table above, read by every later stage. Step through; at verification, remove the isolation cell.Share freely with credit: ‘Figure from chipfieldguide.com’

Researchers at the University of Michigan built a whole computer about one millimeter on each side, smaller than a grain of rice. It stacks tiny layers that hold a processor, memory, sensors, a radio, a battery and solar cells.

One version was small enough to sit inside a human eye and check its pressure, to watch for an eye disease. Asleep, it used far less than a billionth of a watt. The Computer History Museum has called it the world’s smallest computer.

The Michigan Micro Mote (M3) is a complete computer about a cubic millimeter in size. It is an extreme edge device, which makes its trade-offs easy to see.

  • Stacked chips. It combines chips from three manufacturing processes of different ages (65, 130 and 180 nm, where a smaller number means smaller transistors). The chips are ground down from 300 to 150 µm thick, stacked like a staircase, and joined by fine wires between the steps.
  • Energy budget. When it is working it draws tens of microwatts, but its solar cell recharges the battery at only tens of nanowatts, about a thousandth of that. So it spends almost all of its time asleep.
  • Tiny batteries. The thin-film batteries are about 1 mm² and hold 0.5–5 µAh. If they are only lightly drained each time, they last more than 10,000 charge cycles. Drained by 60% or more, their capacity can collapse within tens of cycles.
  • Reuse. The team built more than a dozen different systems by designing each layer as a reusable module, with a shared bus (the wires the layers talk over) and coordinated power states.

The project’s lessons map directly onto the flow.

  • Power intent outran the tools. Isolation and level conversion between many power domains were largely manual, so not every power state was simulated before tapeout. Every unsimulated state is a scenario first exercised on silicon.
  • Three spins per new block. First a large debug chip full of test points, then a form-factor chip with most debug removed, then a third spin to fix minor issues and scale production.
  • Corners from the field. Chips tested only at 25 °C behaved differently implanted at 40 °C, which showed the need to design for a wider temperature range and its effect on power draw. Some 180 nm chips were light-sensitive and needed black epoxy, with a clear window over the solar cell.
  • Programming and debug. The stacks are too small to attach wires to, so the team added an ultra-low-power optical receiver for programming. Once sealed, the radio is the only output, and debugging is limited by the energy budget: long sessions drain the battery deeply and shorten its life.
Awake (active)30 µWSolar harvest30 nWAverage use300 nWasleep 35 pW10 pW100 pW1 nW10 nW100 nW1 µW10 µW100 µWbattery draining

Awake 1% of the time (14 min a day): average 300 nW, 10× the harvest. The battery drains.

The Micro Mote’s budget: awake it draws tens of µW, its solar cell gives tens of nW. Drawn at 30 µW and 30 nW (illustrative), with the 35 pW standby of the eye-pressure version. Log scale.Share freely with credit: ‘Figure from chipfieldguide.com’

Sources

Show Hide 11 sources
  1. Energy Efficient Computing Systems: Architectures, Abstractions and Modeling to Techniques and StandardsRajeev Muralidhar, Renata Borovica-Gajic, Rajkumar Buyya · arXiv (ACM Computing Surveys) · 2022Dynamic power A·C·V²·f; leakage 20–40% of a microprocessor’s power budget in recent processes; clock gating, power gating with header/footer switches, multi-Vt, DVFS.
  2. IEEE 1801-2024: IEEE Standard for Design and Verification of Low-Power Energy-Aware Electronic SystemsIEEE Standards Association · IEEE · 2025Standard page (title, number, March 2025 publication date, scope): a method for specifying power intent, used to verify a design against its power-management architecture and to drive its implementation.
  3. Lessons from Five Years of Making Michigan Micro MotesPat Pannuto, Yoonmyung Lee, ZhiYoong Foo, Gyouho Kim, David Blaauw, Prabal Dutta · WARP 2015 workshop (Cornell) · 2015Several power domains; manual isolation and level conversion so not all power states simulated; per-domain clock networks; cold-boot reset for isolation; 3-spin model; 65/130/180 nm stack thinned to 150 µm; tens of µW active vs tens of nW harvested; thin-film battery cycle life; 25 °C vs 40 °C; light sensitivity; optical programming.
  4. Near-Threshold Computing: Reclaiming Moore’s Law Through Energy Efficient Integrated CircuitsRonald G. Dreslinski, Michael Wieckowski, David Blaauw, Dennis Sylvester, Trevor Mudge · Proceedings of the IEEE (author copy, David Blaauw’s group, University of Michigan) · 2010Near-threshold energy and delay trade-offs; subthreshold minimum-energy point.
  5. IC Manufacturing, Cost, Power, and Dependability (COE 501 lecture slides)Muhamed Mudawar · King Fahd University of Petroleum and MineralsDie yield and die cost formulas; worked example in which doubling die area from 60 to 120 mm² raises cost per good die about 2.43× (recomputed from the slide’s own inputs; the slide’s 962 good dies for 60 mm² is a multiplication slip for 926, which gave its 2.52×).
  6. RF CMOSWikipediaRF, analog, and digital circuits integrated on one CMOS chip; used in phone and wireless transceivers.
  7. AI Benchmark: All About Deep Learning on Smartphones in 2019Andrey Ignatov, Radu Timofte, et al. · arXiv (ICCV Workshops 2019) · 2019Mobile AI accelerators from five SoC vendors; performance nearly doubling each generation.
  8. Physical Fault Injection and Side-Channel Attacks on Mobile Devices: A Comprehensive AnalysisCarlton Shepherd, Konstantinos Markantonakis, Nico van Heijningen, et al. · Computers & Security; arXiv:2105.04454 · 2021Section 2.2.3: Apple Secure Enclave as an independent SoC subsystem with its own processor (SEP), TRNG, PKA and AES-based Memory Protection Engine; separation resists software side channels such as cache timing; undisclosed DPA countermeasures.
  9. Substrate Coupling in Digital Circuits in Mixed-Signal Smart-Power SystemsRadu M. Secareanu, Scott Warner, et al., Eby G. Friedman · IEEE Transactions on VLSI Systems (author copy, University of Rochester) · 2004Substrate noise in mixed-signal ICs and mitigation by separation, substrate contacts, guard rings.
  10. Introduction to differential power analysisPaul Kocher, Joshua Jaffe, Benjamin Jun, Pankaj Rohatgi · Journal of Cryptographic Engineering (open access, Springer) · 2011Power measurements leak secret keys; attacks are practical and non-invasive; countermeasures.
  11. The World’s Smallest ComputerDag Spicer · Computer History Museum · 2015Micro Mote components and the 35 pW standby power of the glaucoma-monitor version.