Microbump
Beginner
A very small dot of solder, a metal that melts easily, used to join chips to a silicon slab or to each other.
Novice
A small solder-capped copper bump at a pitch of tens of micrometers, used in 2.5D packages and memory stacks where ordinary flip-chip bumps are too coarse.
Expert
Typically 25–55 µm pitch in UCIe’s advanced-package range. Below roughly 10 µm, solder becomes impractical and bumpless copper-to-copper hybrid bonding takes over.
Explained in Packaging and chiplets (Systems).
See also: Bump pitch, Flip-chip bumps, hybrid bonding.