Bump pitch
Beginner
The spacing between the tiny metal dots that connect a chip to what it sits on. Closer dots mean more connections fit.
Novice
The center-to-center distance between neighboring connection points (solder bumps, microbumps or copper bond pads) on a die. Connections per unit area grow as one over the pitch squared.
Expert
The first-order knob for die-to-die bandwidth density. Roughly 100–130 µm on organic substrates, 25–55 µm on interposers and bridges, under 10 µm with hybrid bonding. Pitch also sets bump current capacity, so power and ground take a share of the array.
Explained in Packaging and chiplets (Systems).
See also: Microbump, hybrid bonding, Bandwidth density.