Final test (package test)
Beginner
Testing each chip again after it is sealed in its protective case, before it ships.
Novice
Production test of each chip after it is sealed in its package, run in a socket on an automated handler, usually with the full set of patterns plus electrical measurements.
Expert
Catches assembly damage and defects wafer sort missed, and runs tests that probe cards can’t deliver. Results feed speed binning and the shipped defect level.
Explained in Design for test (Design Flow).
See also: Wafer sort (probe test), Burn-in.