Wire bond
Beginner
Connecting a chip to its package with very thin wires, each stitched from a pad on the chip to a pad on the package.
Novice
The traditional way to connect a chip to its package: fine wires of gold, copper, silver or aluminum, each welded from a pad on the chip to a pad on the package. It is the cheapest and most flexible option and is used for most packages.
Expert
Pads must sit around the die edge, which caps the connection count, and each wire’s inductance limits signal speed and how much supply current it can deliver cleanly. Flip-chip takes over when pad count, speed or current exceed what the edge can carry.