Heterogeneous integration
Beginner
Building one product from chips made in different factories, each picked for what it does best.
Novice
Combining dies from different process nodes, factories or technologies (logic, memory, analog, photonics) in one package so each part uses the process that suits it.
Expert
The architectural payoff of chiplets beyond yield: dense logic on the newest node, analog PHYs and SRAM-heavy I/O dies on cheaper nodes, DRAM from a memory process, all joined by die-to-die links.