Glossary

backside power delivery

Beginner

Bringing power into the chip from underneath. That leaves the wires on top free to carry signals.

Novice

Putting the chip’s power wiring on the back of the silicon instead of in the stack of wiring layers above the transistors. The front layers are then left for signal wires, and power reaches the transistors through tiny vertical connections from below.

Expert

Separates the power delivery network from the signal metal stack, cutting IR drop and freeing routing tracks. It changes cell design, the heat path and failure analysis, because the substrate side is no longer open for probing.

Explained in AI accelerators and datacenter (Industries).

See also: IR drop.

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